BGAWeldingStation ModelSP360C Specification: Applicable PCB size Max PCB size: 430mmX350mm Applicable BGA size Max size: 55mmX55mm Min size: 7mmX7mm Max weight: 80g Power for operation: 3600W Main heater: 800W Lower heater: 800W Bottom heater: 2000W Machine dimension: 650*500*600mm Machine weight: 36KG Input power: AC 220V 3.6KW ------------------------------------------------------------------------------------------------------------------------- Features High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process.Movable heating head, able to move horizontally; easy to operate;Embedded industrial computer, touch screen interface, PLC control; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2 high definition screen, convenient for operation and observation;Industrial computer able to store unlimited temperature curves, curve analysis can be done on touch screen; both English and Chinese can be input;The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA;The BGA soldering supporting frame can micro-adjusted to avoid local sinkage;Powerful cross flow can cool the lower heating area;The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ;with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA;Set with over temperature alarming and protection function;Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs;The integrated design of machine and chassis is room-saving.