High-end full auto BGA Equipment

BGAEquipment (RW-E6250) Specification PCB dimension: W20×20 W450×W400mm PCB thickness: 0.5 4mm Applicable chip size: 1×1 70×70mm PCB locating way: outer or jig Working table adjustment: ±10mm forward/backward, ±10mm left/right Temperature control: K-type thermocouple, close cycle controlled Preheater: far infrared, 6000W Top heater: hot air,1000W Bottom heater: hot air, 1000W Power supply: single-phase 220V, 50/60Hz, 6KW Airsupply: 5 8kgf/cm2,60L/min Machine dimension: L850×W700×H950mm Weight: Appox.150Kgs --------------------------------------------------------------------------------------------------------------------------------------- Features * Hot air head and mounting head are designed 2 in 1, and have both the auto soldering and mounting function; * Color optical system with functions of split vision, zoom - in and micro- adjustment,equippedwithaberration detection device; with auto focus and software operation function,22X opticalzoom; able to rework BGA sized up to 70mm×70mm; * Touch screen interface, PLC control; able to display temperature curves and five detecting curves at the same time; * Color LCD monitor; * Built-in vacuum pump; 360° rotation in Φ angle; mounting nozzle is micro-adjustable; * 6 segments of temperature up (down) and 6 segments constant temperature control, 200 groups of temperature curve are stored; Curve analysis can be carried out on the touch screen and has the communication function as computers ,with software attached; * Able to arrive at three independent temperature zones,temperature and time can be displayeddigitally on the touch screen;able torework CGA; * The supports rack can be adjusted to restrain the local sinkage of the BGA soldering area; * Suction nozzle can identify material and mounting height automatically, and can control the air pressure within a small range; * Both upper and lower hot-air heating head are movable on the IR preheating area to fit for reworking BGA in different positions on PCB; * Equipped with different alloy hot air nozzles, easy to replace and able to locate in any angle. * Driven by theservo motor,the integrative hot air head can store 20 groups of different BGA heating points and register marks.