High-end BGA rework system (RW-E500A)

Full-automatic BGA Rework System Specification PCB dimension: W20×20 W600×W500mm PCB thickness: 0.5 4mm Working table adjustment: ±10mm forward/backward, ±10mm left/right Temperature control: K-type thermocouple, closeloop controlled PCB locating way: Outer or jig Preheater: far infrared, 6000W Upper heater: hot air, 1000W Lowerheater: hot air, 1000W Power supply: single-phase 380V, 50/60Hz, 10KW Machine dimension: L1350×W800×H1800mm Air supply: 5 8kgf/cm2, 60L/min Weight: Appox. 180Kgs --------------------------------------------------------------------------------------------------------------------------------------- Features * Hot air head and mounting head are designed 2 in 1, and, can store 20 groups of working locations, with the precision to 0.02mm; * Driven by X and Y axes step motor, operated with rocker bar , micro-movable when approaching the destination; able to store 20 groups of data; * Color optical system with functions of split vision, zoom-in and micro-adjustment, equipped with abbreviation detection device, auto focus, software operation,; 30X optical zoom; able to rework BGA sized up to 70mm×70mm; * Touch screen interface, PLC control;real-time temperature curve display;able to display temperature curves and five detecting curves at the same time; * Color LCD monitor; * Suction nozzle can identify automatically material and mounting height, can constrain the pressure within a small range; * Connected with nitrogen outsdie for nitrogen-protected soldering and desoldering; * Build-in vacuum pump; 360° rotation in Φ angle; mounting nozzle is micro-adjustable; * The supports rock can be adjusted to restrain the local sinkage of the BGA soldering area; * 8 segments of temperature up (down) and 8 segments constant temperature control, 50 groups of temperature curve are stored; curve analysis can be carried out on the touch screen;with computer communication function, communication software is attached; * Three independent heating areas, temperature and time can be displayed digitally on the touch screen;can reworkCGA; * Both upper and lower hot-air heating heads are movalbe on the IR preheatingarea to fit for reworking BGA in different positions on PCB; * With function of protecting from lack of air pressure; * Control independently through external computer, and finish all functions; * Automatically pick-up BGA for soldering&desoldering and place BGA to the appointed position; * Large IR pre-heating from the bottom will heat the PCB evenly to avoid deformation and keepsoldering effect; heating board is independently controlled; * Equipped with different alloy hot air nozzles, easy to replace;be able to locate in any angle.