Full-auto BGA Rework Station (AT400)

Specifications: PCB dimension: W20×20 W450×550mm PCB thinkness: 0.3 4mm BGA dimension: 1mm×1mm 70mm×70mm PCB locating way: Outer or JigTemperature control: K-type thermocouple, controlled Lower hot-air heater: 600WUpper hot-air heater: 1000WBottom IR heater: 3000W Min pitch of BGA ball: 0.15mmPlacement precision: 0.01mm Placement pressure: Min 20gMax. BGA weight: 300g Power supply: single-phase 220V,50/60Hz,Gas supply: 0.5-0.8MPa,60L/min Machine dimension: L1000×W900×H560mm Weight: Appox. 210KGS--------------------------------------------------------------------------------------------------------- BGA Rework Station Upper hot air heater head and mounting head are designed 2 in 1, have both the auto soldering and mounting function, auto memorize operating position; Upper heater has a special rapid cooling function toward BGA, meets lead free technology;X, Y, Z table are driven by serve motor, operated by rocker; can micro-adjust when getting close to the target point, Min resetting precision 0.01mm;Color optics alignment system with functions of split vision, zoom in/out and micro-adjust, equipped with aberration detection device; with auto focus and software operation function, 22 X optical focus, able to rework BGA sized up to 70×70mm;Suction nozzle can identify material and mounting height automatically, nozzle can be rotated 360°, and can control the gas pressure within a small range;Nitrogen can be used for protecting soldering & desoldering;Embedded industrial computer, touch screen interface, PLC control, real-time profile display, able to display set profile or 9 practically-tested profiles;8 segments of temperature up(down) and 8 segments constant temperature control, no limited profiles are stored; profile analysis can be carried out on the touch screen; with computer communication function, communication software is attached;Three heaters(upper/lower hot air heater, bottom IR heater) heating independently, can rework BGA on any place of the PCB;Pick up BGA and move it to the place for solder automatically; drive BGA to destination after desolder automatically;Equipped with monitoring camera to observe the whole reworking process, balls melting status can be seen through the camera;