BGA Rework RW-SV550

BGA Rework Specification PCB dimension: W20×D20 W450×D450mm PCB thickness: 0.5 4mm BGA dimension:1×1 70×70mm Working table adjustment: ±10mm forward/backward, ±10mm left/right Temperature control: K-type thermocouple, close cycle controlled PCB locating way: Outer or Jig Bottom Pre-heater: infrared, 3000W Nozzle heater: hot air, 500W Power supply: single-phase 220V, 50/60Hz, 3.5KW Machine Dimension: L700×W650×H800mm Weight: Appox. 120kgs ----------------------------------------------------------------------------------------------------------------------------- Features * Air flow and temperature is adjustable in a wide range to form high temperature breeze; * The movable heating head is easy to operate; hot air head and mounting head are manually controlled;PCB sliding rack is micro-adjustable with X and Y axes; * Color optical system with functions such as split vision, zoom in and micro-adjustment, autofocus and menu operation, and with aberration detecting device; * Color LCD monitor; * Touch screen interface, PLC control; able to display temperature curves and two detecting curves at the same time; * Two independent heating areas, temperature and time are digitally displayed; * Over-heating protection for the hot air heating head; temperature of hot air in the upper and infraredat the bottom is program controllable; with 6 segments of temperature up (down) and 6 segments constant temperature control, 50 groups of temperature curve are stored; Curve analysis can be carried out on the touchscreen;curve are stored; withcomputer communication function as computers ,with communicationsoftware attached; with temperature measurement function; * The supports for the BGA soldering supporting frame are micro-adjustable to restrain local sinkage in the soldering area; * Suction force of the in-built vacuum pump is adjustable; 360° rotation in Φ angle; mounting nozzle is micro-adjustable; * Over-heating protection for the upper hot air heating head; * Versatile device for aplinting PCB suitable for different board; * Large IR pre-heating from the bottom, made of imported high quality heater,will heat the PCB evenly to avoid deformation and keep solder effect; heating board is independent controlled; * Equipped with different alloy hot air nozzles (customizable), easy to replace;