BGA Rework Station---- SP360C Specification: Applicable PCB size Max PCB size: 430mmX350mm Applicable BGA size Max size: 55mmX55mm Min size: 7mmX7mm Max weight: 80g Power for operation: 3600W Main heater: 800W Lower heater: 800W Bottom heater: 2000W Machine dimension: 650*500*600mm Machine weight: 36KG Input power: AC 220V 3.6KW *************************************************************************************************************** Description *High quality heating material produces high-tem breeze, precisely controlling the soldering and desoldering process. * Movable heating head, able to move horizontally; easy to operate; *Embedded industrial computer, touch screen interface, PLC control; real-time temperature curve display, able to display set curve and practically-tested curve; 7.2 high definition screen, convenient for operation and observation; * Industrial computer able to store unlimited temperature curves, curve analysis can be done on touch screen; both English and Chinese can be input; *The temperatures of the upper and lower heater can be precisely controlled according to set temperatures; bottom constant temperature infrared heating area; appropriate temperature control apparatus can ensure safe rework for BGA; *The BGA soldering supporting frame can micro-adjusted to avoid local sinkage; * Powerful cross flow can cool the lower heating area; *The adjustable PCB positioning supports, easy and fast to install PCB; special fixture for installing allotype boards ; *with sound alarming function after finishing soldering or desoldering; hand vacuum pen easy for picking up BGA; *Set with over temperature alarming and protection function; *Equipped with different hot gas nozzles, easy to replace; can be customized according to specific needs; *The integrated design of machine and chassis is room-saving.