Soldering Station(BS190)BGA Soldering Station Specification: Heating board dimension: L200×W150mm T emperature range: 0 400oC Heating board material: AL Heating power
BS240 BGA Solder StationBGA Solder Station Specification Heating board dimension: L240*W180mmTemperature control: K-type Thermocouple, close cycle controlledHeating power: 1
RW-B500C BGA Welding MachineBGAWelding Machine-RW-B500C Advantage: 1. Auto-generated profile, multi steps of temperature control 2. Embedded industrial computer, PLC with stable
BGA Equipment RW-E6250Full -auto BGA Equipment Specification PCB dimension: W20×20 W450×W400mm PCB thickness: 0.5 4mm Applicable chip size: 1×1 70×
Name is empty
Wrong Email Address
Выберите страну доставки
You have not written a message
By clicking on the "Send" button, you agree that your data will be used to process your request. Further information and revocation instructions can be found in the data protection declaration.
Your message has been sent!
Close